package dimensions schematic plastic infrared light emitting diode qee122 qee123 1/9/04 page 1 of 4 ?2004 fairchild semiconductor corporation description the qee12x is a 880 nm algaas led encapsulated in a medium wide angle, plastic sidelooker package. features = 880 nm package type = sidelooker chip material = algaas matched photosensor: qse113 medium wide emission angle, 50 package material: clear epoxy high output power orange stripe on the top side 0 .1 7 5 (4 .4 4 ) 0 .2 0 0 (5 .0 8 ) 0 .0 5 0 (1 .2 7 ) 0 .0 2 0 (0 .5 1 ) s q . (2 x ) 0 .5 0 0 (1 2 .7 0 ) m in 0 .0 6 5 (1 .6 5 ) 0 .0 9 5 (2 .4 1 ) c a t h o d e a n o d e 0 .1 0 0 (2 .5 4 ) 0 .1 0 0 (2 .5 4 ) n o m 0 .0 3 0 (0 .7 6 ) 0 .0 8 7 (2 .2 2 ) anode cathode notes: 1. dimensions for all drawings are in inches (mm). 2. tolerance of .010 (.25) on all non-nominal dimensions unless otherwise speci ed.
1/9/04 page 2 of 4 ? 2004 fairchild semiconductor corporation plastic infrared light emitting diode qee122 qee123 notes: 1. derate power dissipation linearly 1.33 mw/ c above 25 c. 2. rma ux is recommended. 3. methanol or isopropyl alcohols are recommended as cleaning agents. 4. soldering iron 1/16" (1.6 mm) minimum from housing . absolute maximum ratings (t a = 25 c unless otherwise speci ed) parameter symbol rating unit operating temperature t opr -40 to + 100 c storage temperature t stg -40 to + 100 c soldering temperature (iron) (2,3,4) t sol-i 240 for 5 sec c soldering temperature (flow) (2,3) t sol-f 260 for 10 sec c continuous forward current i f 50 ma reverse voltage v r 5v power dissipation (1) p d 100 mw electrical / optical characteristics (t a =25 c) parameter test conditions symbol min typ max units peak emission wavelength i f = 100 ma pe 880 nm emission angle i f = 100 ma 2 1/2 50 deg. forward voltage i f = 100 ma, tp = 20 ms v f 1.7 v reverse current v r = 5 v i r 10 a radiant intensity qee122 i f = 100 ma, tp = 20 ms i e 4 16 mw/sr radiant intensity qee123 i f = 100 ma, tp = 20 ms i e 8 mw/sr rise time i f = 100 ma t r 800 ns fall time t f 800 ns
1/9/04 page 3 of 4 ? 2004 fairchild semiconductor corporation plastic infrared light emitting diode qee122 qee123 fig.1 normalized radiant intensity vs. forward current lens tip separation (inches) fig.2 coupling characteristics of qee123 and qse113 0123456 i c (o n ) - n o r m a l iz e d c o l l e c t o r c u r r e n t (m a ) 0.0 0.2 0.4 0.6 0.8 1.0 i f = 20 ma fig.3 forward voltage vs. ambient temperature fig. 5 radiation diagram 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 1.0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 fig. 4 normalized intensity vs. wavelength (nm) i f = 100 ma normalized to: d = 0 i f pulsed t pw = 100 s duty cycle = 0.1 % v cc = 5 v r l = 100 ? t a = 25 ? c i f - forward current (ma) 1 10 100 1000 i e - n o r m a l iz e d r a d ia n t in t e n s it y 0.001 0.01 0.1 1 10 normalized to: i f = 100 ma pulsed t pw = 100 s duty cycle = 0.1 % t a = 25 ? c v f - f o r w a r d v o l t a g e ( v ) t a - ambient temperature ( ? c) -40 -20 0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 normalized to: i f pulsed t pw = 100 s duty cycle = 0.1 % i f = 100 ma i f = 10 ma i f = 50 ma i f = 20 ma 775 800 825 850 875 900 925 950 n o r m a l iz e d r a d ia n t in t e n s it y 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
life support policy fairchild s products are not authorized for use as critical components in life support devices or systems without the express written approval of the president of fairchild semiconductor corporation. as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. a critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. fairchild does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. 1/9/04 page 4 of 4 ? 2004 fairchild semiconductor corporation plastic infrared light emitting diode qee122 qee123
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